Zipper Bag for Packing PCB/Wafer--Suzhou Sky Industrial Co., Ltd.

Purchase Qty.: (Pieces)	3,000-9,999 10,000+
FOB Unit Price:	US $0.06 US $0.03

Purchase Qty. (Pieces)	FOB Unit Price
3,000-9,999	US $0.06
10,000+	US $0.03

Basic Info

Model NO.: SZ-MB002
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation
Shape: Open Top, Ziplock, Three Dimensional, Gusset
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE
Function: Anti Static, Moisture Barrier, Light Isolation
Color: Silver
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
Origin: China Suzhou

Application: Promotion, Household, Chemical, Pricise Equipment, PC Board, IC, CD Driver
Material: Laminated Material
Making Process: Composite Packaging Bag
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
Industrial Use: Electronic Components, Semiconductive Industry
Surface Handling: Gravure Printing
Trademark: DIASAP
Specification: SGS RoHS report
HS Code: 3923210000

Product Description

zipper bag for packing PCB/Wafer

1.This zipper bag for packing PCB/Wafer is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

2.The bag is mainly applied to pack electronic components(PCB,IC,HDdriver),
precise equipment and chemical raw material etc.

3.The third party reports can be offered, such as ROHS,Halogen testing report.

Product Description
Product Name	zipper bag for packing PCB/Wafer
Material Structure	Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	customized
Surface Resistance	10^6~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.

zipper bag for packing PCB/Wafer Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

Product Pictures:
Zipper Bag for Packing PCB/Wafer

Factory show:
Zipper Bag for Packing PCB/Wafer

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6.    Humidity Indicator Card
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Contact:

Eric

T e l: +86 - 512- 668 775 37

Q Q: 2851720857

W h a t s A p p: +86 139 125 129 59

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