MODEL: RW-B400C: Low-end industrial Computer Interfaced IR / Hot-Air BGA Rework Station for laptop components repair
Specification:
Max. PCB size | 430*350mm |
Max. processing area | 120*120mm |
PCB thickness: | 0.5~4mm |
Max. temp. for hot-air heater: | 350° |
Max. temp. for IR heater : | 400° |
Upper heater(hot air): | 600W |
Lower heater(hot air): | 800W |
Bottom IR heater: | 2700W |
Power supply: | AC singal-phase 220V 50/60Hz |
Applicable BGA: | 4*4~55*55mm |
Temperature control: | 8-Stage Programmable Temperature Settings |
Max BGA weight: | 80g |
Machine Weight: | 60KG |
Machine Dimension: | L660*W630*H600mm |
FEATURES:
1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled;
2. The movable heating head,which is able to move freely horizontally,is easy to be operated;
3. Embedded industrial computer,Touch screen interface,PLC control,realtime temperature curve display, able to display temperature curves and detecting curves at the same time;
4. 8 segments of temperature up/down and 8 segments constant temperature control,50,000 groups of
temperature curve are stored,Curve analysis can be carried out on the touchscreen.
5. The temperature of the upper and lower hot air guns can be precisely controlled according to their spectific temperature, the infrared constant temperature heating zone at the lower part and the appropriate temperature-control settings make the rework safer and more reliable .
6. The supports for the BGA soldering supporting frame are mirco-adjustable to restrain local sinkage;
7. Powerful cross flow fans cool the lower heating area rapidly.
8. The adjustable PCB positioning support,onto which are special fixtures for allotype board could be installed,enables easy and fast positioning of the PCB board .
9. Buzz after solding is finished or desoldering;hand vacuum pen is adjustable for removing BGA;
10.Both the upper and lower parts are equipped with over temperature alarming and protection apparatus.