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Type:Packaging Bags
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Brand Name:
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Place of Origin:China (Mainland)
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Port:Shanghai, China
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Production Capacity:0 per
Product Details
- Model NO.: SZ-MB002
- Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation
- Shape: Open Top, Ziplock, Three Dimensional, Gusset
- Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE
- Function: Anti Static, Moisture Barrier, Light Isolation
- Color: Silver
- Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
- Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
- Origin: China Suzhou
- Application: Promotion, Household, Chemical, Pricise Equipment, PC Board, IC, CD Driver
- Material: Laminated Material
- Making Process: Composite Packaging Bag
- Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
- Industrial Use: Electronic Components, Semiconductive Industry
- Surface Handling: Gravure Printing
- Trademark: DIASAP
- Specification: SGS RoHS report
- HS Code: 3923210000
Basic Info
Product Description
zipper bag for packing PCB/Wafer
1.This zipper bag for packing PCB/Wafer is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.
2.The bag is mainly applied to pack electronic components(PCB,IC,HDdriver),
precise equipment and chemical raw material etc.
precise equipment and chemical raw material etc.
3.The third party reports can be offered, such as ROHS,Halogen testing report.
Product Description | |
Product Name | zipper bag for packing PCB/Wafer |
Material Structure | Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE |
Feature | Anti-static, moisture barrier,light isolation |
Printing | customized |
Surface Resistance | 10^6~10^11 Ohm |
Thickness | Customized(0.06--0.2mm available) |
Bag Style | open top/ zip lock/ envelope/ gusset/ three dimensional |
Package | 50~100pcs per bag and then in cartons or as per customer's request |
Usage | Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
zipper bag for packing PCB/Wafer Technical Parameters:
NO. | Item | Standard | Result |
1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
3 | Decay time | IEC61340-5-1 | <0.3s |
4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
6 | Heat-Seal Temperature | 160%±10% | |
7 | Heat-Seal Pressure | 70Pa | |
8 | Heat-Seal Time | ≤1.5S |
Product Pictures:
![Zipper Bag for Packing PCB/Wafer]()
![Zipper Bag for Packing PCB/Wafer]()
Factory show:
![Zipper Bag for Packing PCB/Wafer]()
Factory show:
Other related products:
1. ESD Shielding Bag
2. ESD Bubble Cushioned Bag
3. Nylon Bag/Vacuum Bag
4. Air Bubble Bag/making Machine
5. Industrial Cotton Swab Series
6. Humidity Indicator Card
7. Cleanroom Consumable Series
Contact:
Eric
T e l: +86 - 512- 668 775 37
Q Q: 2851720857
W h a t s A p p: +86 139 125 129 59
Eric
T e l: +86 - 512- 668 775 37
Q Q: 2851720857
W h a t s A p p: +86 139 125 129 59